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Features
* Guaranteed Output Voltage Accuracy within 2% * Fast Transient Response * Load Regulation: 0.1% Typ. * Line Regulation: 0.03% Typ. * Low Dropout Voltage: 1.1V Typ. at IOUT =1A * On-chip Thermal Limiting: 150C Typ. * Adjustable Output: 1.25~10.7V * Standard 3-pin SOT-223 and TO252 Power Packages
EP1117
1A Low Dropout Linear Regulator
Description
The EP1117 is a low dropout three-terminal adjustable or fixed-voltage regulator with 1A output current capability. The EP1117 is available in an adjustable version, with output ranging from 1.25V to 10.7V and fixed output voltages of 1.8V, 2.5V, 3.3V and 5.0V. Dropout voltage is guaranteed at a maximum of 1.3V at 1A. On-chip thermal limiting provides protection against any combination of overload that would create excessive junction temperatures. The EP1117 is available in the industry standard 3-pin the low profile surface mount SOT-223 and TO-252 power packages.
Applications
* PC peripheral * Low Voltage Logic Supplies * Post Regulator for Switching Power Supply
Typical Application
Fixed Mode Regulator 1.25V to 10.7V Adjustable Regulator
VIN 10uF VIN VOUT EP1117 FB R1 120 100uF VOUT
R2 120
VOUT= VREF x 1 +

R2 R1
VREF =1.25V R1100~200
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Pin Assignment
EP1117
Ordering Information
Pin Description
Pin 1 2 Name FB/GND VOUT Function A resistor divider from this pin to the Vout pin and ground sets the output voltage. (Ground only for Fixed-Mode) The output of the regulator. A minimum of 10uF capacitor (0.15 ESR 20) must be connected from this pin to ground to insure stability. The input pin of regulator. Typically a large storage capacitor (0.15 ESR 20) is connected from this pin to ground to insure that the input voltage does not sag below the minimum dropout voltage during the load transient response. This pin must always be 1.3V higher than Vout in order for the device to regulate properly.
3
VIN
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Absolute Maximum Rating (Note 1)
Symbol VI TJ TSTG Input Voltage Operating Junction Temperature Range Control Section Power Transistor Storage Temperature Range Item Rating 15 0 ~ +125 0 ~ +150
EP1117
(Note 2)
Units V C C
-65 ~ +150
TL Lead Temperature (Soldering, 10s) +260 C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: The values here show the absolute maximum rating, and for normal usage please refer the test condition in Electrical Characteristics Table.
Electrical Characteristics (Note 3)
Unless otherwise noted, these specifications apply over CIN = 10F, COUT = 10F, and TA=0C to 70C. Typical values refer to TA=25C.
Symbol VREF Parameter Reference Voltage Conditions TJ=0C ~125C, 10mAIOUT1A, 1.4V(VIN -VOUT) 10.75V TJ=0C ~125C, 0IOUT1.5A, 3.25VVIN 9V TJ=0C ~125C, 0IOUT 1A, 3.95VVIN9V TJ=0C ~125C, 0IOUT1A, 4.75VVIN 12V TJ=0C ~125C, 0IOUT1A, 6.5VVIN 12V IOUT=10mA, 1.5V (Note4) (VIN -VOUT)10.75V IOUT=0A, (Note4) 3.25VVIN9V IOUT=0A, (Note4) 3.95VVIN9V IOUT=0A, (Note4) 4.75VVIN12V IOUT=0A, (Note4) 6.5VVIN12V Min. 1.225 Typ. 1.250 Max. 1.275 Units V
EP1117-18 EP1117-25 EP1117-33 EP1117-50 EP1117-adj EP1117-18 REGLINE Line Regulation EP1117-25 EP1117-33 EP1117-50
1.764 2.450 3.235 4.900
1.800 2.500 3.300 5.000 0.03 1 1 1 1
1.836 2.550 V 3.365 5.100 0.2 6 6 mV 6 10 %
VOUT
Output Voltage
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Electrical Characteristics (Continued) (Note 3)
Symbol Parameter EP1117 EP1117-18 REGLOAD Load Regulation EP1117-25 EP1117-33 EP1117-50 Conditions (VIN -VOUT)=3V, (Note4) 0IOUT1A VIN=3.25V, (Note4) 0IOUT1A VIN=3.95V, (Note4) 0IOUT1A VIN=4.75V, (Note4) 0IOUT1A VIN=6.5V, (Note4) 0IOUT1A IOUT=100mA (Note5) IOUT=500mA IOUT=1A (VIN -VOUT)=5V, TJ=25C (VIN -VOUT)=3V, IOUT=10mA 10mAIOUT1A, 1.4V(VIN -VOUT)10.75V (VIN -VOUT)=10.75V
(Note6)
EP1117
Unless otherwise noted, these specifications apply over CIN = 10F, COUT = 10F, and TA=0C to 70C. Typical values refer to TA=25C.
Min. Typ. 0.1 1 1 1 1 1 1.05 1.1 1.1 60 0.2 5 60 75 0.01 0.5 TJ=125C, 1000Hrs TJ=25C, 10HzF10KHz, (% of VOUT) Junction to case, at Tab junction to ambient Junction-to-Ambient (No heat sink ;No air flow) 0.3 0.003 15 117 92 150 0.02 120 5 10 Max. 0.4 10 10 mV 10 15 1.1 1.2 1.3 Units %
VD ILIMIT IFB IFB IO PSRR TR TS LS VN
Dropout Voltage Current Limit FB Pin Current FB Pin Current Change Minimum Load Current Ripple Rejection Thermal Regulation Temperature Stability Long-Term Stability RMS Output Noise Thermal Resistance Thermal Resistance SOT-223 TO-252
V A
A A
mA dB %/W % % % C/W C/W C
fRIPPLE=120Hz, VRIPPLE= 1VP-P, (VIN -VOUT)=3V TJ=25C, 30ms Pulse
th JA
OT
Over Temperature Point
Note 3: 100% production test at +25C. Specifications over the temperature range are guaranteed by design and characterization. Note 4: See thermal regulation specifications for changes in output voltage due to heating effects. Load line regulations are measured at a constant junction temperature by low duty cycle pulse testing. Note 5:Dropout voltage is specified over the full output current range of the device. Dropout voltage is defined as the minimum input/output differential measured at the specified output current. Test points and limits are also shown on the Dropout Voltage Curve. Note 6: Minimum load current is defined as the minimum output current required to maintain regulation.
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Typical Performance Characteristics
EP1117
Functional Block Diagram
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Output Voltage
EP1117
The EP1117 develops a 1.25V reference voltage between the output and the FB terminal. By placing a resistor between these two terminals, a constant current is caused to flow through R1 and down through R2 to set the overall output voltage. Normally this current is chosen to be the specified minimum load current of 10mA. For fixed voltage devices R1 and R2 are included in the device.
+IFBR2 R1 Figure 1-Basic Adjustable Regulator
VOUT= VREF x 1 +

R2
Load Regulation
When the adjustable regulator is used, load regulation will be limited by the resistance of the wire connecting the regulator to the load. The datasheet specification for load regulation is measured at the output pin of the EP1117. Best load regulation is obtained when the top of the resistor divider (R1) is tied directly to the output pin of the device, not to the load. For fixed voltage devices, the top of R1 is internally connected to the output, and the ground pin can be connected to low side of the load. If R1 were connected to the load, RP is multiplied by the divider ratio, the effective resistance between the regulator and the load would be: RPx(1+R2/R1), where RP is Parasitic Line Resistance.
Rp Parasitic Line Resistance VIN VIN VOUT EP1117 FB R1 Connect R1 to Case R2 RL
Connect R2 to Load
Figure 2-Connections for Best Load Regulation
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Input Capacitor Output Capacitor
EP1117
An input capacitor of 10F or greater is recommended. Tantalum or aluminum electrolytic capacitors can be used for bypassing. Larger Values will improve ripple rejection by bypassing the input to the regulator.
The EP1117 requires an output capacitor to maintain stability and improve transient response. The EP1117 output capacitor selection is dependent upon the ESR (equivalent series resistance) of the output capacitor to maintain stability. When the output capacitor is 10F or greater, the output capacitor should have an ESR less than 1. This will improve transient response as well as promote stability. A low-ESR solid Tantalum capacitor works extremely well and provides good transient response and stability over temperature. Aluminum electrolytes can also be used, as long as the ESR of the capacitor is less than 1. The value of the output capacitor can be increased without limit. Higher capacitance values help to improve transient response and ripple rejection and reduce output noise.
Ripple Rejection
The curves for Ripple Rejection were generated using an adjustable device with the FB pin bypassed. With a 22F bypassing capacitor 75dB ripple rejection is obtainable at any output level. The impedance of the FB pin capacitor, at the ripple frequency, should beThermal Considerations
The EP1117 regulators have thermal protection to limit junction temperature to 150C. However, device functionality is only guaranteed to a maximum junction temperature of +125C. A heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. Figure 3 and 4 show for the SOT-223 and TO-252 the measured values (JA) for different copper area sizes using a 2 layers, 1.6mm, and 6Sq. cm FR-4 PCB with 2oz. copper and a ground plane layer on the backside area used for heat sinking. It can be used as a rough guideline in estimating thermal resistance. Both the SOT-223 and TO-252 packages use a copper plane on the PCB and the PCB itself as a heat sink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.
Figure 3-(JA) vs copper area for SOT-223 package
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EP1117
Figure 4-(JA) vs copper area for TO-252 package The thermal resistance for each application will be affected by thermal interactions with other components on the board. Some experimentation will be necessary to determine the actual value. The power dissipation of EP1117 is equal to: PD = (VIN - VOUT) x IOUT Maximum junction temperature is equal to: TJUNCTION = TAMBIENT + (PD x (JA)) Note: TJUNCTION must not exceed 125C
Safe Operation Area
Using the experiment result of previous Thermal Consideration (choose the one with 1.5cm*1.5cm polygene area) and (JA)=50C/W spec, the safe operation area of EP1117 in SOT-223 and TO-252 packages can be obtained as Figure 5.
Output Current (mA)
0.85
1.00 1.15 1.30
1.45 1.60
1.75 1.90
2.05 2.20
2.35
2.50 2.65
Figure 5-Safe Operation Area of EP1117 in SOT-223 and TO-252 packages (Limited by Power Dissipation with TJUNCTION < 125C)
Jul. 2006 8/10
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Package Description
SOT-223 (Reference JEDEC Registration SOT-223)
D B1
EP1117
H E
K e e1 A1 L c A
B
DIM A A1 B B1 c D E e e1 H L K
MILLIMETERS MIN. 1.50 0.02 0.60 2.90 0.28 6.30 3.30 NOM. - - - - - - - 2.30 REF. 4.60 REF. 6.70 0.91 1.50 0 - - - - 13 7.30 1.10 2.00 10 0.261 0.035 0.059 0 MAX. 1.80 0.08 0.80 3.10 0.32 6.70 3.70 MIN. 0.059 0.001 0.023 0.113 0.011 0.246 0.129
INCHES NOM. - - - - MAX. 0.070 0.003 0.031 0.121 0.012 0.261 0.144
- - -
0.090 REF. 0.179 REF. - - - - 13
0.285 0.043 0.078 10
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Package Description (Continued)
TO-252
D b L2
EP1117
E
L1 e e1 c Seating Plane c1 b1 A1 L H A
DIM A A1 b b1 c c1 D E e e1 H L L1 L2
MILLIMETERS MIN. 2.18 0.89 5.20 0.45 0.45 6.35 5.40 NOM. 2.29 - 5.35 0.61 TYP. 0.52 0.52 6.58 5.57 2.28 REF. 4.57 REF. 9.00 0.51 0.64 0.88 9.70 - 0.83 - 10.40 - 1.02 1.27 0.354 0.020 0.025 0.035 0.58 0.58 6.80 6.20 0.018 0.018 0.250 0.213 MAX. 2.40 1.14 5.50 MIN. 0.086 0.035 0.205
INCHES NOM. 0.090 - 0.211 0.024 TYP. 0.020 0.020 0.259 0.219 0.090 REF. 0.180 REF. 0.382 - 0.033 - 0.409 - 0.040 0.050 0.023 0.023 0.268 0.244 MAX. 0.094 0.045 0.217
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